Sunday 8 May 2011

New Intel 3D Chip Technology May Have Capability of Penetrating Mobile Market

Summary
This article discusses the potential impact on ARM of the new 3D Trig-ate Chip technology that Intel has just recently announced.  This chip technology is clearly aimed at the mobile device market, and not necessarily at the PC market.
Analysis
1. Today, ARM and MIPS are the dominant suppliers of chip technology to mobile equipment manufacturers whether they be smart phones or PAD computers.  The problem for Intel which has been desperately trying to get a piece of the market is that their technology has been too slow compared to the ARM dual core processors ( and potentially quad core processors).  In addition, the Intel processors for mobile applications are not as power efficient as the ARM devices, therefore not allowing manufacturers that would use Intel to bring out devices with longer battery life.  This is a key issues in smart phones and PAD computers.
2. Intel and others have been working on the potential for 3 D transistor for over 10 years.  almost all semiconductors today are planar (flat).  The secret sauce that Intel has claimed to developed has a third dimension of height which h they claims gives better speed and power use performance than current chips.
3. This new Intel process will be implemented in a 22 nm process which is certainly a leading edge CMOS process node.  EVen if Intel is successful with the chips they will still need to develop the software that will allow their chips to work with the latest p[hone operating systems.in an efficient manner.
4. 3-D chip technology is also being looked at in the memory area in a somewhat different manner.  As an example, SanDisk is looking at the 3D stacking of memory cells as one of the next breakthrough in flash memory technology.

Source link: http://www.glgroup.com/News/New-Intel-3D-Chip-Technology-May-Have-Capability-of-Penetrating-Mobile-Market-53868.html?cb=1

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